Epoxy Resin Adhesive (Heat curing type) - EP138,EP106NL,EP116new,EP171,EP170,EP170-2,EP160,EP811One Component Epoxy Adhesives
EP138
EP170
EP811 *Made to order products
Features
- One-part heat curing adhesive
- As a mixing process is not required, no measuring and mixing errors will occur, eliminating variations in bonding performance.
- A wide variety of models, including a heat-resistant type, a low-viscosity type, and a low-temperature curing type, are available.
Product details
・Multi-purpose type：EP138, EP106NL, EP116新, EP171
・Flexible type：EP170, EP170-2
・Heat resistance type：EP160
・Potting electronics：EP811 *Made to order products
Product data
Viscosity by temperature (EP116新)
| Measurement temperature | EP116新 |
|---|---|
| 15℃ | 33.1 |
| 20℃ | 15.9 |
| 23℃ | 10.7 |
| 25℃ | 8.3 |
| 30℃ | 4.6 |
| 35℃ | 2.7 |
| 40℃ | 1.7 |
| 45℃ | 1.1 |
| 50℃ | 0.7 |
Test method : JIS K7117-2
Viscometer: BH-type rotational viscometer (Rotor No.6, 20rpm)
Heat aging test (EP116新)
| 0h | 24h | 96h | 192h | 240h | ||
|---|---|---|---|---|---|---|
| EP116新 | 180℃ | 30.4 | - | 10.1 | - | 10.7 |
Adherends:SPCC
Surface treatment: Degreased with MEK
Curing condition: 150℃ × 10 min
Measurement temperature: Each sample was removed after being left at
Tension speed: 2.5 mm/min
Engine oil immersion test (EP116新)
| 0h | 24h | 96h | 192h | 240h | ||
|---|---|---|---|---|---|---|
| EP116新 | 165℃ | 30.4 | - | - | 2.6 | - |
Adherends: SPCC
Surface treatment: Degreased with MEK
Curing condition: 150℃ × 10 min
Engine oil used: Honda Ultra Oil S9 (10W-40)
Measurement temperature: Each sample was removed after being left at a designated temperature for a designated time, and then left at room temperature for more than 24 hours. After this, measurements were made.
Tension speed: 2.5 mm/min
Adhesive Strength (EP811) *Made to order products
| Measurement temperature | SPCC | Copper | LCP | |||||
|---|---|---|---|---|---|---|---|---|
| 23℃ | 19.7 | TCF | 15.0 | TCF | 8.6 | MF | ||
| 260℃x10min.→23℃x10min. | 19.3 | TCF | 15.4 | TCF | 8.4 | MF | ||
TCF : Thin layer cohesive failure of adhesive MF : Material Failure
Test method : JIS K6850
Curing conditions : 120℃×30min
Surface treatment (SPCC,Copper): Degreased with MEK
Surface treatment (LCP): Degreased with IPA
Bonding length: 1/2 lap
Thermal shock test : Measured after test sample is heating at 260℃ for 10minutes and kept at 23℃ 50%RH for 10minutes
Property
Multi-purpose type
| EP138 | EP106NL | EP116新 | EP171 | |||
|---|---|---|---|---|---|---|
| Application / Properties / Features | High-viscosity non-sag type | Low-viscosity flow type | Low-viscosity flow type/High peel-resistant type | Low-temperature curing type | ||
| Type | One-Part Heat Curing Epoxy Adhesive | |||||
| Base | Epoxy resin | Epoxy resin | Epoxy resin | Epoxy resin | ||
| Appearance | Light yellowish brown | Milky white | Gray | Light brown | ||
| Viscosity | Pa･s/23℃ | 240 | 22 | 10.7 | 50 | |
| Density | g/cm3 | 1.4 | 1.18 | 1.2 | 1.19 | |
| Standard curing conditions | 120℃×30min | 120℃×40min | 150℃×20min | 80℃×30min | ||
| 150℃×20min | 140℃×30min | 120℃×10min | ||||
| Tensile Shear Strength | MPa | 25.6 | 24.1 | 30.4 | 22.1 | |
| T-Peel Strength | N/mm | 3.06 | 3.48 | 4.6 | 0.2 | |
| Cured properties | Hardness | Shore D | 88 | 84 | 80 | 87 |
| Glass transition temperature | ℃ | 122 | 91 | 96 | 83 | |
| Elastic modulus | MPa | 1215 | ||||
| Curing Shrinkage Rate | % | 0.53 | ||||
| Water Absorption Ratio | % | 0.1 | 0.14 | 0.13 | ||
| Linear Expansion Coefficient | 5.7×10-5 | 7.8×10-5 | 7.6×10-5 | 6.0×10-5 | ||
| Electric Characteristics | Volume Resistivity | Ω･cm | 3.0×1015 | 2.6×1015 | 3.0×1015 | |
| Surface Resistivity | Ω/sq | 6.6×1015 | ||||
| Insulation Breakdown Voltage | kV/mm | 16＜ | ||||
| Dielectric Constant | 100Hz | 4.7 | 3.6/1kHz | |||
| Dielectric Loss Tangent | 100Hz | 0.01 | 0.01/1kHz | |||
| Storage temperature | ℃ | 0～10 | 0～10 | 0～10 | 0～10 | |
| Capacity | 1kg | 1kg | 1kg | 1kg | ||
| 3kg | 3kg | 20kg | 20kg | |||
| Check It At Online-Shop | ||||||
Flexible type
| EP170 | EP170-2 | |||
|---|---|---|---|---|
| Application / Properties / Features | High peel-resistant type | High peel-resistant type /Non-sag type |
||
| Type | One-Part Heat Curing Epoxy Adhesive (Flexible type) |
|||
| Base | Epoxy resin | Epoxy resin | ||
| Appearance | Light yellow | Light yellow | ||
| Viscosity | Pa･s/23℃ | 170 | 340 | |
| Density | g/cm3 | 1.13 | 1.12 | |
| Standard curing conditions | 110℃×60min | 110℃×60min | ||
| 120℃×30min | 120℃×30min | |||
| Tensile Shear Strength | MPa | 15.1 | 10.8 | |
| T-Peel Strength | N/mm | 6.67 | 6.6 | |
| Cured properties | Hardness | Shore D | 55 | |
| Glass transition temperature | ℃ | 20 | ||
| Water Absorption Ratio | % | 0.23 | ||
| Linear Expansion Coefficient | 30×10-5 | |||
| Electric Characteristics | Volume Resistivity | Ω･cm | 3.0×1015 | |
| Capacity | 1kg | 1kg | ||
| Check It At Online-Shop | ||||
Heat resistance type
| EP160 | |||
|---|---|---|---|
| Application / Properties / Features | Heat-resistant type /Medium viscosity |
||
| Type | One-Part Heat Curing Epoxy Adhesive | ||
| Base | Epoxy resin | ||
| Appearance | Light brown | ||
| Viscosity | Pa･s/23℃ | 100 | |
| Density | g/cm3 | 1.16 | |
| Standard curing conditions | 110℃×60min | ||
| 120℃×30min | |||
| Tensile Shear Strength | MPa | 16.8 | |
| T-Peel Strength | N/mm | 1.18 | |
| Cured properties | Hardness | Shore D | 85 |
| Glass transition temperature | ℃ | 140 | |
| Elastic modulus | MPa | 414 | |
| Breaking Strength | N/mm2 | 22.6 | |
| Elongation At Break | % | ||
| Curing Shrinkage Rate | % | 2.43 | |
| Water Absorption Ratio | % | 0.05 | |
| Linear Expansion Coefficient | 6.5×10-5 | ||
| Electric Characteristics | Volume Resistivity | Ω･cm | 2.6×1015 |
| Surface Resistivity | Ω/sq | ||
| Insulation Breakdown Voltage | kV/mm | ||
| Dielectric Constant | 100Hz | 4.5 | |
| Dielectric Loss Tangent | 100Hz | 0.011 (1kHz) | |
| Capacity | 1kg | ||
| Check It At Online-Shop | |||
Potting electronics
| EP811 | |||
|---|---|---|---|
| Application / Properties / Features | Flow type | ||
| Type | One-Part Heat Curing Epoxy Adhesive | ||
| Base | Epoxy resin | ||
| Appearance | Black | ||
| Viscosity | Pa･s/23℃ | 82 | |
| Density | g/cm3 | 1.71 | |
| Standard curing conditions | 120℃×30min | ||
| Tensile Shear Strength | MPa | 19.7 | |
| Cured properties | Hardness | Shore D | 91 |
| Glass transition temperature | ℃ | 134 | |
| Elastic modulus | MPa | 6600 | |
| Poisson's ratio | 0.3 | ||
| Breaking Strength | MPa | 59 | |
| Elongation At Break | % | 1.19 | |
| Water Absorption Ratio | % | 0.05 | |
| Linear Expansion Coefficient | 25 | ||
| Electric Characteristics | Volume Resistivity | Ω･cm | 5.0×1015 |
| Insulation Breakdown Voltage | kV/mm | 22＜ | |
| Dielectric Constant | 100Hz | 5.2 | |
| Dielectric Loss Tangent | 100Hz | 0.1 | |
| Capacity | 4kg | ||
| 10kg | |||
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Description of the mark
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This mark means that products comply with RoHS Directiverequirements.
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This mark means that products comply with Japanese formaldehyde emission standards for adhesives. These are set forth by the Japanese Industrial Standards (JIS) or Japan Adhesive Industry Association (JAIA).
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This mark means that products comply with Japanese Voluntary VOC Regulating Rule for Indoor Air Pollution Control. These are set forth by Japan Adhesive Industry Association (JAIA).
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This mark is a self-management mark for people and environmentally friendly products. We provide products that address environmental and health concerns, mainly for construction and housing applications.