Epoxy Resin Adhesive (Heat curing type) - EP138,EP106NL,EP116new,EP171,EP170,EP170-2,EP160,EP811One Component Epoxy Adhesives

EP138

EP170

EP811

Features

  • One-part heat curing adhesive
  • As a mixing process is not required, no measuring and mixing errors will occur, eliminating variations in bonding performance.
  • A wide variety of models, including a heat-resistant type, a low-viscosity type, and a low-temperature curing type, are available.

Product details
・Multi-purpose type:EP138, EP106NL, EP116新, EP171
・Flexible type:EP170, EP170-2
・Heat resistance type:EP160
・Potting electronics:EP811

Product data

Viscosity by temperature (EP116新)

(Pa・s)
Measurement temperature EP116新
15℃ 33.1
20℃ 15.9
23℃ 10.7
25℃ 8.3
30℃ 4.6
35℃ 2.7
40℃ 1.7
45℃ 1.1
50℃ 0.7

Test method : JIS K7117-2
Viscometer: BH-type rotational viscometer (Rotor No.6, 20rpm)

Heat aging test (EP116新)

(MPa)
0h 24h 96h 192h 240h
EP116新 180℃ 30.4 - 10.1 - 10.7

Adherends:SPCC
Surface treatment: Degreased with MEK
Curing condition: 150℃ × 10 min
Measurement temperature: Each sample was removed after being left at designated temperature for designated time, and then left at room temperature for more than 24 hours. After this, measurements were made.
Tension speed: 2.5 mm/min

Engine oil immersion test (EP116新)

(MPa)
0h 24h 96h 192h 240h
EP116新 165℃ 30.4 - - 2.6 -

Adherends: SPCC
Surface treatment: Degreased with MEK
Curing condition: 150℃ × 10 min
Engine oil used: Honda Ultra Oil S9 (10W-40)
Measurement temperature: Each sample was removed after being left at a designated temperature for a designated time, and then left at room temperature for more than 24 hours. After this, measurements were made.
Tension speed: 2.5 mm/min


Adhesive Strength (EP811)

(MPa)
Measurement temperature SPCC Copper LCP
23℃ 19.7 TCF 15.0 TCF 8.6 MF
260℃x10min.→23℃x10min. 19.3 TCF 15.4 TCF 8.4 MF

TCF : Thin layer cohesive failure of adhesive MF : Material Failure
Test method : JIS K6850
Curing conditions : 120℃×30min
Surface treatment (SPCC,Copper): Degreased with MEK
Surface treatment (LCP): Degreased with IPA
Bonding length: 1/2 lap

Thermal shock test : Measured after test sample is heating at 260℃ for 10minutes and kept at 23℃ 50%RH for 10minutes

Property

Multi-purpose type

EP138 EP106NL EP116新 EP171
Application / Properties / Features High-viscosity non-sag type Low-viscosity flow type Low-viscosity flow type/High peel-resistant type Low-temperature curing type
Type One-Part Heat Curing Epoxy Adhesive
Base Epoxy resin Epoxy resin Epoxy resin Epoxy resin
Appearance Light yellowish brown Milky white Gray Light brown
Viscosity Pa・s/23℃ 240 22 10.7 50
Density g/cm3 1.4 1.18 1.2 1.19
Standard curing conditions 120℃×30min 120℃×40min 150℃×20min 80℃×30min
150℃×20min 140℃×30min 120℃×10min
Tensile Shear Strength MPa 25.6 24.1 30.4 22.1
T-Peel Strength N/mm 3.06 3.48 4.6 0.2
Cured properties Hardness Shore D 88 84 80 87
Glass transition temperature 122 91 96 83
Elastic modulus MPa 1215
Curing Shrinkage Rate % 0.53
Water Absorption Ratio % 0.1 0.14 0.13
Linear Expansion Coefficient 5.7×10-5 7.8×10-5 7.6×10-5 6.0×10-5
Electric Characteristics Volume Resistivity Ω・cm 3.0×1015 2.6×1015 3.0×1015
Surface Resistivity Ω/sq 6.6×1015
Insulation Breakdown Voltage kV/mm 16<
Dielectric Constant 100Hz 4.7 3.6/1kHz
Dielectric Loss Tangent 100Hz 0.01 0.01/1kHz
Storage temperature 0~10 0~10 0~10 0~10
Capacity 1kg 1kg 1kg 1kg
3kg 3kg 20kg 20kg
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Flexible type

EP170 EP170-2
Application / Properties / Features High peel-resistant type High peel-resistant type
/Non-sag type
Type One-Part Heat Curing Epoxy Adhesive
(Flexible type)
Base Epoxy resin Epoxy resin
Appearance Light yellow Light yellow
Viscosity Pa・s/23℃ 170 340
Density g/cm3 1.13 1.12
Standard curing conditions 110℃×60min 110℃×60min
120℃×30min 120℃×30min
Tensile Shear Strength MPa 15.1 10.8
T-Peel Strength N/mm 6.67 6.6
Cured properties Hardness Shore D 55
Glass transition temperature 20
Water Absorption Ratio % 0.23
Linear Expansion Coefficient 30×10-5
Electric Characteristics Volume Resistivity Ω・cm 3.0×1015
Capacity 1kg 1kg
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Heat resistance type

EP160
Application / Properties / Features Heat-resistant type
/Medium viscosity
Type One-Part Heat Curing Epoxy Adhesive
Base Epoxy resin
Appearance Light brown
Viscosity Pa・s/23℃ 100
Density g/cm3 1.16
Standard curing conditions 110℃×60min
120℃×30min
Tensile Shear Strength MPa 16.8
T-Peel Strength N/mm 1.18
Cured properties Hardness Shore D 85
Glass transition temperature 140
Elastic modulus MPa 414
Breaking Strength N/mm2 22.6
Elongation At Break %
Curing Shrinkage Rate % 2.43
Water Absorption Ratio % 0.05
Linear Expansion Coefficient 6.5×10-5
Electric Characteristics Volume Resistivity Ω・cm 2.6×1015
Surface Resistivity Ω/sq
Insulation Breakdown Voltage kV/mm
Dielectric Constant 100Hz 4.5
Dielectric Loss Tangent 100Hz 0.011 (1kHz)
Capacity 1kg
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Potting electronics

EP811
Application / Properties / Features Flow type
Type One-Part Heat Curing Epoxy Adhesive
Base Epoxy resin
Appearance Black
Viscosity Pa・s/23℃ 82
Density g/cm3 1.71
Standard curing conditions 120℃×30min
Tensile Shear Strength MPa 19.7
Cured properties Hardness Shore D 91
Glass transition temperature 134
Elastic modulus MPa 6600
Poisson's ratio 0.3
Breaking Strength MPa 59
Elongation At Break % 1.19
Water Absorption Ratio % 0.05
Linear Expansion Coefficient 25
Electric Characteristics Volume Resistivity Ω・cm 5.0×1015
Insulation Breakdown Voltage kV/mm 22<
Dielectric Constant 100Hz 5.2
Dielectric Loss Tangent 100Hz 0.1
Capacity 4kg
10kg